Out on the line, one hot spot can kill an entire carrier of Micro LED epiwafers. Soft bake and hard bake aren’t just parameters on a screen—they’re the line in the sand between a clean pattern and a scrap lot. So we built the Micro LED wafer drying heater to run that thermal step the way the fab demands: no excursions, no particles, no surprise stops. What matters, technically We hold wafer-level thermal uniformity to ±0.1°C across the chuck. Even a small skew will push critical dimension control and mess with sidewall profile. Short-wave infrared gives fast, non-contact heating that keeps the surface clean. The heater body is quartz and high-purity ceramic, built for Class 1–100 cleanroom use with particle generation kept to a minimum. Temperature repeatability is there so the photoresist bake window closes—every time, shift after shift. Here’s why it holds up in Micro LED work: the thermal budget is tight. You have to clear solvents, control edge bead, and stabilize the polymer without overshoot that can damage metallization or shift emissive layers. The heater locks in the bake curve so lithography stays consistent across lots. That translates to fewer reworks, less scrap, and a cycle time you can count on. Energy use stays disciplined, too—efficient radiant transfer and targeted dwell control cut down on waste heat that makes chamber thermal management a headache. A few practical notes Installation comes down to cleanroom airflow and solid EMI grounding. You get the best performance when exhaust and shielding are matched to the platform. Commissioning is quick, but you’ll still want to tune the recipe for your exact photoresist stack and substrate stack-up. Plan on routine calibration. That ±0.1°C uniformity is only meaningful if you keep it that way over long production runs.