Compact infrared dryer for IC

Wed, 10 Jun 2026 01:55:00 +0800

On the line, you know how it goes: a soft bake drift of ±0.5°C and you’re printing linewidth error straight into the resist. The oven is too slow, the hotplate eats up space, and the thermal budget is already spoken for. So we built a compact infrared dryer for IC that shuts that drift down at the source. What matters under the hood We run near-infrared (NIR) emitters inside a reflector-integrated quartz module, so the heat couples directly and responds in sub-seconds. Across the bake zone, wafer-level uniformity holds at ±0.1°C, and run-to-run repeatability sits at ±0.05°C. Temperature setpoints are traceable, and the profile stays consistent—day or night, 24/7. Cleanroom fit is baked in from the start: materials meet Class 1–100, seals are low-outgassing, and the laminar flow exhaust keeps particle generation at zero once you’re in steady state. Why this lands in lithography Because in lithography, temperature control is the lever that moves critical dimension control and defect performance. With this kind of precision, you can run soft bake and hard bake inside tighter thermal windows, cut photoresist rework, and keep the exposure stack consistent. The footprint is small enough for tight bays, and it retrofits cleanly into existing tracks. Energy use is low, too—NIR heats the target, not the chamber—and the fast ramp shortens cycle time without beating up the wafer with extra thermal stress. Here are the practical details The dryer integrates cleanly, but you need a dedicated exhaust tie-in and a stable voltage feed. Voltage ripple can show up as temperature jitter, so get that right. Line up tool communication and recipe mapping up front, and match the bake time to your resist thickness. Once it’s set, it runs with the quiet predictability that semiconductor processes demand.

IC on Advanced Carbon Infrared Heaters

Compact infrared dryer for IC